Vespel(R) Manual Wands for 6 and 8-inch Semiconductor Wafer Handling
Designed to handle 6 and 8-inch semiconductor wafers.
The area touching a wafer is made of
Withstand up to 288C continuously
Wafer edge contact: 5.5mm(Top), 15.0mm(Bottom)
Length: 154mm, Weight: 47g
Click on the photo to download the drawing.
for more information.
Die Handling Tool