Vacuum Wand (Vacuum Pencil, Vacuum Pen) for Semiconductor Silicon Wafer Processing: Vacuum Pick Up Tool

Vacuum Wand for Semiconductor Wafer Processing

Our unique valve* ensures reliable suction and release of a semiconductor wafer.
The well polished inner wall of the valve part minimizes particle generation.
The optically polished wafer tip provides excellent adhesion to a wafer.
The wand body can be easily detached from the tubing.

*US Patent 6176265, Japanese Patents 1698352 and 1885465

You can find the wand which meets your requirements on our interactive catalog.

C series for ESD protection

ESD Safe Vacuum Wand for Semiconductor Silicon Wafer Processing: The wafer tip is made of Conductive PEEK. Vacuum pens for SMD/die handling are available.

The body covered with Conductive Nylon reduces electrostatic effects towards a wafer.
The wafer tip is made of Conductive PEEK (Polyetheretherketon).
The resistance value of 10⁶ to 10⁸ ohms provides optimum static protection.
For 5, 6, 8 and 12-inch wafer handling

F series Teflon(R) body
Teflon Vacuum Wand for Semiconductor Silicon Wafer Handling: The wand body is made of Teflon(R) for chemical resistance. Vacuum pens for die/SMD handling are available.

The body is made of Teflon(R) for chemical resistance.
A large selection of wafer tips available.
For 2-3, 4, 5, 6, 8 and 12-inch wafer handling

Accessories / Parts

Vacuum Pump
ESD Safe Tubing
Static Dissipative Grounding Kit
Wand Stand
Portable Leak Detector
Replacement Parts
Component Parts List for C series
Component Parts List for F series

Vacuum Wands for die and small diameter semiconductor wafer handling

Do not touch the small hole on the wand body during operation.

Please contact our distributor for more information.

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