Vacuum Wand for Semiconductor Wafer Processing

  • Our unique valve* ensures reliable suction and release of a semiconductor wafer.
  • The well polished inner wall of the valve part minimizes particle generation.
  • The optically polished wafer tip provides excellent adhesion to a wafer.
  • The wand body can be easily detached from the tubing.
*US Patent 6176265, Japanese Patents 1698352 and 1885465
You can find the wand which meets your requirements on our interactive catalog.

C series for ESD protection
ESD Safe Vacuum Wand for Semiconductor Silicon Wafer Processing: The wafer tip is made of Conductive PEEK. Vacuum pens for SMD/die handling are available.

F series Teflon(R) body
Teflon Vacuum Wand for Semiconductor Silicon Wafer Handling: The wand body is made of Teflon(R) for chemical resistance. Vacuum pens for die/SMD handling are available.
Accessories / Parts

Vacuum Wands for die and small diameter semiconductor wafer handling
Do not touch the small hole on the wand body during operation.

Please contact our distributor for more information.


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